IEC 61190-1-3 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

International Electrotechnical Commission , 03/22/2002

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 03/22/2002

Published:03/22/2002

Pages:65

File Size:1 file , 590 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).