IEC 61191-2 Ed. 1.0 b:1998

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

International Electrotechnical Commission , 08/28/1998

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 08/28/1998

Published:08/28/1998

Pages:49

File Size:1 file , 570 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).