IEC 62769-6 Ed. 3.0 b:2023

Field Device Integration (FDI) - Part 6: FDI Technology Mapping

International Electrotechnical Commission , 04/01/2023

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 04/01/2023

Published:04/01/2023

Pages:18

ISBN(s):9782832264775

File Size:1 file , 550 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62769 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®1) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.