IEC 62878-1 Ed. 1.0 b:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

International Electrotechnical Commission , 10/14/2019

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 10/14/2019

Published:10/14/2019

Pages:38

File Size:1 file , 1.6 MB

Language:English, French

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IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.