IEC 62878-2-5 Ed. 1.0 b:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

International Electrotechnical Commission , 09/16/2019

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 09/16/2019

Published:09/16/2019

Pages:112

File Size:1 file , 5.8 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62878-2-5 defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.