IPC 1601

Printed Board Handling and Storage Guidelines

Association Connecting Electronics Industries , 08/01/2010

Publisher: IPC

File Format: PDF

$48.00$97.00

Description

Standard By:Association Connecting Electronics Industries , 08/01/2010

Published:08/01/2010

Pages:28

File Size:1 file , 1.1 MB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability.