IPC 4101B

Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)

Association Connecting Electronics Industries , 06/01/2006

Publisher: IPC

File Format: PDF

$86.00$173.00

Description

Standard By:Association Connecting Electronics Industries , 06/01/2006

Published:06/01/2006

Pages:112

File Size:1 file , 600 KB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

This specification covers the requirements for base materials (laminate and prepreg) to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. This document contains more than 50 separate specification sheets and now uses search terms to allow the user to find similar groups of materials from these specification sheets. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand the newer assembly operations employing higher thermal exposures, including those assembly practices that utilize the now commonly-encountered lead free solders.

IPC 4101B

Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)

IPC 4101B History

IPC 4101E-WAM1

IPC 4101E

IPC 4101D-WAM1

IPC 4101D

IPC 4101C

IPC 4101B

IPC 4101A

IPC 4101

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