IPC 6018D

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Association Connecting Electronics Industries , 02/01/2022

Publisher: IPC

File Format: PDF

$91.00$182.00

Description

Standard By:Association Connecting Electronics Industries , 02/01/2022

Published:02/01/2022

Pages:60

ISBN(s):9781638160601

File Size:1 file , 2.7 MB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.