IPC 7530

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Association Connecting Electronics Industries , 06/01/2001

Publisher: IPC

File Format: PDF

$50.00$101.00

Description

Standard By:Association Connecting Electronics Industries , 06/01/2001

Published:06/01/2001

Pages:24

File Size:1 file , 120 KB

Language:Chinese

Note:This product is unavailable in Russia, Ukraine, Belarus

During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This document provides guidelines for the construction of appropriate profiling test vechicles and various techniques and methodologies for temperature profiling.