SAE AMS3690C

Adhesive Compound, Epoxy Room Temperature Curing

SAE International , 07/20/2009

Publisher: SAE

File Format: PDF

$30.00$61.00

Description

Standard By:SAE International , 07/20/2009

Published:07/20/2009

File Size:1 file , 82 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.

This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 \mDF (85 \mDC), but usage is not limited to such applications.