TIA TSB-144

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges

Telecommunications Industry Association , 04/01/2003

Publisher: TIA

File Format: PDF

$46.00$93.00

Description

Standard By:Telecommunications Industry Association , 04/01/2003

Published:04/01/2003

Pages:24

File Size:1 file , 4.2 MB

Language:English

The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.