IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

International Electrotechnical Commission , 09/29/2000

Publisher: IEC

File Format: PDF

$72.00$145.00

Standard By:International Electrotechnical Commission , 09/29/2000

Published:09/29/2000

Pages:34

File Size:1 file , 320 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

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