IEC 60749-15 Ed. 2.0 b:2010

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

International Electrotechnical Commission , 10/28/2010

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 10/28/2010

Published:10/28/2010

Pages:14

File Size:1 file , 430 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.