IEC 60749-15 Ed. 3.0 b:2020

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

International Electrotechnical Commission , 07/14/2020

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 07/14/2020

Published:07/14/2020

Pages:17

File Size:1 file , 1000 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.