• IEC 61190-1-2 Ed. 1.0 b:2002

IEC 61190-1-2 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

International Electrotechnical Commission , 03/22/2002

Publisher: IEC

File Format: PDF

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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

IEC 61190-1-2 Ed. 1.0 b:2002 History

IEC 61190-1-2 Ed. 3.0 b:2014
IEC 61190-1-2 Ed. 2.0 en:2007
IEC 61190-1-2 Ed. 2.0 b:2007
IEC 61190-1-2 Ed. 1.0 b:2002

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