IEC 61190-1-2 Ed. 2.0 b:2007

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

International Electrotechnical Commission , 04/26/2007

Publisher: IEC

File Format: PDF

$60.00$121.00


IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

IEC 61190-1-2 Ed. 2.0 b:2007 History

IEC 61190-1-2 Ed. 3.0 b:2014
IEC 61190-1-2 Ed. 2.0 en:2007
IEC 61190-1-2 Ed. 2.0 b:2007
IEC 61190-1-2 Ed. 1.0 b:2002

More IEC Standards PDF

IEC 61029-2-7 Ed. 1.0 b:1993
IEC 60244-9 Ed. 2.0 b:1993

IEC 60244-9 Ed. 2.0 b:1993

$164.00 $329.00

IEC 61178-3-1 Ed. 1.0 b:1993
IEC 60674-3-4 Ed. 1.0 b:1993