IEC 61191-3 Ed. 1.0 b:1998

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

International Electrotechnical Commission , 08/28/1998

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 08/28/1998

Published:08/28/1998

Pages:31

File Size:1 file , 530 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).