IEC 61191-3 Ed. 1.0 b:1998

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

International Electrotechnical Commission , 08/28/1998

Publisher: IEC

File Format: PDF

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Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

IEC 61191-3 Ed. 1.0 b:1998 History

IEC 61191-3 Ed. 2.0 en:2017
IEC 61191-3 Ed. 2.0 b:2017
IEC 61191-3 Ed. 1.0 b:1998

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