IEC 61191-3 Ed. 2.0 en:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

International Electrotechnical Commission , 05/30/2017

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 05/30/2017

Published:05/30/2017

Pages:20

File Size:1 file , 470 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.