IEC 62137-1-1 Ed. 1.0 b:2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

International Electrotechnical Commission , 05/14/2008

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 05/14/2008

Published:05/14/2008

Pages:30

File Size:1 file , 1000 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.