IEC 62137-1-1 Ed. 1.0 en:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

International Electrotechnical Commission , 07/11/2007

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 07/11/2007

Published:07/11/2007

Pages:15

File Size:1 file , 290 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.