IEC 62137-1-2 Ed. 1.0 en:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

International Electrotechnical Commission , 07/25/2007

Publisher: IEC

File Format: PDF

$40.00$81.00

Description

Standard By:International Electrotechnical Commission , 07/25/2007

Published:07/25/2007

Pages:17

File Size:1 file , 290 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

The test method is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.