IEC 62453-302 Ed. 1.0 en:2009

Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

International Electrotechnical Commission , 06/30/2009

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 06/30/2009

Published:06/30/2009

Pages:32

File Size:1 file , 1.4 MB

Language:English

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IEC 62453-302:2009(E) provides information for integrating the CIP technology into the FDT interface specification (IEC 62453-2). It specifies communication and other services. This specification neither contains the FDT specification nor modifies it. Communication Profile Family 2 (commonly known as CIP^TM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet^TM2), CP 2/2 (EtherNet/IP^TM3), and CP 2/3 (DeviceNet^TM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNet^TM1), also based on CIP^TM, is defined in [14].

This publication is to be read in conjunction with IEC 62453-2:2009.