IEC 62453-302 Ed. 3.0 b:2023

Field device tool (FDT) interface specification – Part 302: Communication profile integration – IEC 61784 CPF 2

International Electrotechnical Commission , 11/01/2023

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 11/01/2023

Published:11/01/2023

Pages:78

ISBN(s):9782832277805

File Size:1 file , 1.3 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62453 provides information for integrating the CIP™ technology into the FDT interface specification (IEC 62453-2). Communication Profile Family 2 (commonly known as CIP™1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet™2), CP 2/2 (EtherNet/IP™3), and CP 2/3 (DeviceNet™1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNet™1), also based on CIP™, is defined in IEC 62026-7.

This part of IEC 62453 specifies communication and other services.

This specification neither contains the FDT specification nor modifies it.