IPC 7525

Stencil Design Guidelines

Association Connecting Electronics Industries , 05/01/2000

Publisher: IPC

File Format: PDF

$48.00$97.00

Description

Standard By:Association Connecting Electronics Industries , 05/01/2000

Published:05/01/2000

Pages:20

File Size:1 file , 330 KB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

This new document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. This is the first time this important information has been collected and published in an industry consensus document. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed; this includes overprint, two-print and step stencil designs. A sample order form and a user inspection checklist are also included.