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  • IPC 7525

IPC 7525

Stencil Design Guidelines

Association Connecting Electronics Industries , 05/01/2000

Publisher: IPC

File Format: PDF

$48.00$97.00


Standard By:Association Connecting Electronics Industries , 05/01/2000
Published:05/01/2000
Pages:20
File Size:1 file , 330 KB
Language:English
Note:This product is unavailable in Russia, Ukraine, Belarus
This new document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. This is the first time this important information has been collected and published in an industry consensus document. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed; this includes overprint, two-print and step stencil designs. A sample order form and a user inspection checklist are also included.

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