IPC 7525B

Stencil Design Guidelines

Association Connecting Electronics Industries , 10/01/2011

Publisher: IPC

File Format: PDF

$50.00$101.00

Description

Standard By:Association Connecting Electronics Industries , 10/01/2011

Published:10/01/2011

Pages:36

File Size:1 file , 2.1 MB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.